Photo Chemical Etching Micro Etched Lead Frames with Customized Materials

Photo Chemical Etching Micro Etched Lead Frames with Customized Materials

Lead Frames Overview

Xinhaisen Technology specializes in manufacturing precision-etched lead frames for semiconductor and microelectronics packaging. Our lead frames serve as the critical interconnection platform for IC chips, providing superior electrical conductivity, heat dissipation, and mechanical stability. Utilizing advanced chemical etching technology, we deliver products with unmatched dimensional accuracy for applications in QFN, DFN, SOP, SSOP and other advanced packaging formats.

Lead Frames Features

• Burr-Free & Stress-Free: The etching process creates smooth edges without the mechanical stress or burrs common in stamped parts, preventing delamination and improving reliability.

• Design Flexibility: Easy and cost-effective to iterate complex designs, fine pitches, and custom geometries without the high cost of hard stamping dies.

• High Precision & Consistency: Achieves exceptional accuracy for fine-pitch applications and ensures uniform quality across large production batches.

• Material Versatility: Capable of processing a wide range of alloys, including high-conductivity copper (C194, KLF-1), low-CTE Alloy 42, and Kovar.

• Rapid Prototyping: Significantly faster lead time for prototypes and pre-production samples compared to traditional methods.

Lead Frames Specification

Lead Frames Applications
Our etched lead frames are essential components in various semiconductor and microelectronic packages:

• Integrated Circuits (ICs): For various package types (e.g., QFN, DFN, SOP).

• Discrete Semiconductors: Transistors, diodes, and power devices.

• Optoelectronics: LED packages and light sensor housings.

• Advanced Packaging: Substrates for system-in-package (SiP) and multi-chip modules.

Our Advantages

• Speed for All Volumes: Unmatched responsiveness for urgent prototypes, mid-volume batches, and high-volume production orders.

• Precision as Standard: Core expertise in micro-etching ensures we meet the most demanding specifications for fine-pitch and ultra-thin lead frames.

• Vertical Quality Control: From sourcing certified raw materials to in-process SPC and final AOI, we ensure every part meets specification.

• One-Stop Solution: We handle the entire process from design review to etching, forming, plating, and packaging.

• Proven Partner: Trusted by clients in communications, automotive, and consumer electronics for reliability and consistent performance.

FAQ

Q1: What is the main difference between stamped and etched lead frames?
A: Stamping uses physical dies to punch out the shape, which is fast for simple designs but can cause burrs and mechanical stress. Etching is a chemical process that dissolves the metal to create the pattern. It is burr-free, stress-free, and ideal for complex, high-density, and ultra-thin lead frames without the need for expensive hard tooling.

Q2: What is the minimum thickness and line width you can achieve?
A: We can process materials from 0.02mm up to 1.5mm in thickness. Our minimum line width is 0.015mm, and we can achieve micro-holes as small as 0.03mm in diameter, with tolerances as tight as ±0.01mm.

Q3: Can you provide selective plating on lead frames?
A: Yes. We work with partners who offer various post-etching surface finishes, including selective silver plating, nickel-palladium-gold plating, tin plating, and anti-tarnish treatments to meet specific assembly and wire-bonding requirements.

Q4: How quickly can I get a prototype?
A: Our tooling-less process allows for very fast turnaround times. Prototypes can often be completed in days, not weeks, allowing you to test and validate your designs rapidly.

Q5: Can you handle large volume production?
A: Absolutely. Our facility is equipped to handle massive, time-sensitive orders. With our advanced roll-to-roll production lines, we can efficiently meet high-volume demands while maintaining strict quality control and consistency.

Welcome to contact us at any time!