Precision 0.015mm Line Width Micro Etched Lead Frame For Automobile

Precision 0.015mm Line Width Micro Etched Lead Frame for Automobile

Product Overview

Xinhsen Technology specializes in manufacturing precision-etched lead frames for semiconductor and microelectronics packaging. Our lead frames serve as the critical interconnection platform for IC chips, providing superior electrical conductivity, heat dissipation, and mechanical stability. Utilizing advanced chemical etching technology, we deliver products with unmatched dimensional accuracy for applications in QFN, DFN, SOP, SSOP and other advanced packaging formats.

Key Features

Ultra-Precise Etching Technology 

Achieves fine pitch down to 0.05mm with tight tolerance of ±0.01mm 

Produces smooth burr-free edges for perfect die attachment

Material Expertise 

Works with various alloys including Cu (C194, C7025), Fe-Ni (Alloy 42), and Kovar

Thickness range: 0.1mm-1.0mm

Advanced Design Capabilities

Complex multi-array patterns with precise half-etching technology

Custom geometries for specific thermal/electrical requirements 

Superior Quality

Flatness control within 0.02mm/mm²

100% automated optical inspection

Technical Parameters

Material Options: Copper alloys (C194, C7025), Alloy 42, Kovar 

Thickness Range: 0.1mm-1.0mm

Minimum Pitch: 0.05mm

Tolerance: ±0.01mm (critical dimensions)

Surface Roughness: Ra ≤ 0.8μm

Package Types: QFN, DFN, SOP, SSOP, DIP, etc.

Competitive Advantages

Precision Beyond Stamping

Achieves finer features and tighter tolerances than conventional stamping

No mechanical stress or deformation

Performance Data

Rapid Prototyping

Sample lead time: 5-7 working days

DFM analysis included

Cost-Effective Solutions

Lower tooling costs compared to stamping

Flexible MOQ from prototypes to mass production

Comprehensive Services

One-stop solution from design to plating (Ag, NiPdAu, etc.)

ISO 9001 & IATF 16949 certified

FAQ

Q: What's the benefit of etched lead frames vs stamped ones?

A: Etching provides better precision (especially for fine pitch), no burrs, and no mechanical stress on materials.

Q: Can you handle lead frame arrays for multi-chip packaging?

A: Yes, we specialize in high-density multi-array designs with precise half-etching technology.

Q: What surface finishes do you offer?

A: We provide various plating options including silver, NiPdAu, and selective plating.

Q: What's your typical production capacity?

A: We support mass production up to 50 million units/month with consistent quality control.

Why Choose Xinhsen?

With 15+ years of precision etching experience, we combine cutting-edge technology with stringent quality control to deliver lead frames that meet the most demanding semiconductor requirements. Our technical team works closely with clients to optimize designs for performance and manufacturability.