| Brand Name: | XHS/Customize |
| Model Number: | Customize |
| MOQ: | 10 |
| Price: | 50-100USD |
| Payment Terms: | T/T |
| Supply Ability: | 10000-100000PCD / week |
Custom Metal Etching Lead Frames with Tight Tolerances for Advanced Sensor and MEMS Applications
Lead Frames Overview
Xinhaisen Technology is a leading manufacturer of high-precision etched lead frames for semiconductor packaging, ICs, LEDs, and power electronics. Our chemically etched lead frames offer superior dimensional accuracy, excellent conductivity, and reliable performance for advanced electronic applications. With state-of-the-art etching technology, we ensure tight tolerances, burr-free edges, and cost-effective solutions for both prototyping and mass production.
Manufacturing Process
We utilize state-of-the-art chemical etching (photochemical machining) to produce lead frames with fine features and tight tolerances. The process involves:
Material cleaning and pretreatment
Photoresist coating and UV exposure using high-precision tooling
Controlled chemical etching to form precise geometries
Thorough cleaning, inspection, and quality verification
This method allows for burr-free, stress-free production without altering material properties, enabling complex designs with rapid turnaround.
High Precision: Micro-features with line widths down to 0.015mm and positional accuracy within ±0.03mm
Wide Material Compatibility: Supports copper alloys, stainless steel, aluminum, nickel alloys, and more
Burr-Free & Stress-Free: No mechanical deformation, ensuring optimal electrical and thermal performance
Design Flexibility: Rapid prototyping and customization for complex geometries
Scalable Production: Efficient handling of both small batches and high-volume orders
| Parameter | Specification |
| Material Options | Stainless Steel, Alloys,etc. |
| Thickness | 0.02mm – 1.5mm (Customizable) |
| Tolerance | ±0.01mm |
| Surface Finish | Matte, Electropolished, Silver/Plating (optional) |
| Flatness | ≤0.05mm/m² |
| Production Capacity | Prototypes to high-volume (millions/month) |
Lead frames are widely used in:
IC packaging (QFN, QFP, SOP, DIP, etc.)
Power semiconductor devices
LED packaging
Sensors and micro-electromechanical systems (MEMS)
Automotive electronics and communication modules
Medical and optical devices
Our Advantages
Rapid Response: Quick material sourcing and fast production cycles, even for urgent or large-scale orders
Precision Expertise: Advanced etching technology ensures consistent high accuracy and fine detail
Versatility: Ability to process various metals and complex designs without tooling wear
Quality Focus: Strict process control and inspection to meet industry standards
Customer-Centric Service: Dedicated support from design optimization to delivery, ensuring smooth project execution
What services can we provide?
Packaging & Handling Instructions
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