Copper Etching Ultra Thin High Precision Brass Vapor Chamber for Cooling System
Product Details
| Materials: | Stainless Steel, Titanium Or Customized | Thickness: | 0.02mm -3mm |
|---|---|---|---|
| Shape: | As Client's Request | Tolerance: | +/- 0.005mm |
| Production Process: | Photo Chemical Etching, Plating, Stamping, Laser Cutting | ||
| Highlight |
ultra thin brass vapor chamber,high precision copper etching vapor chamber,vapor chamber for cooling system |
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Product Description
Copper Etching Ultra Thin High Precision Brass Vapor Chamber for Cooling System
| The etched copper VC heat spreader is a new-generation heat dissipation component manufactured using a precision etching process. Its key feature is the integration of capillary microstructures into the inner wall of the copper housing through chemical etching, thereby achieving thinner dimensions and more efficient heat dissipation. | ![]() |
Specifications of Etched Ultra Thin Vapor Chamber:
|
Materials |
Copper, Stainless Steel, Brass or Customized |
|
Thickness |
0.2mm to 1mm |
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Main Processing |
Chemical Etching / Photochemical etching / Chemical Milling |
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Etched Depth |
Half etched, depth upon customers’ request |
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Thermal conductivity equivalent |
up to >10,000 W/m·K |
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Channel Pattern |
Upon customers’ request |
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Shape |
Square, rectangle, circle, or customized |
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Other Processing |
Vacuum brazing / diffusion bonding sealing |
Features of Etched Ultra Thin Vapor Chamber:
The etching process is a critical technical step in the manufacture of VC heat spreaders. It involves selectively etching a copper substrate through chemical or physical means to form a predetermined microstructure (such as capillary channels, cavities, and support pillars) on the substrate’s surface. Compared to traditional capillary core structures made by laying copper mesh or sintering copper powder, the etching process offers significant advantages:
- High precision and excellent consistency:
Etching precision can reach ±0.01 mm, allowing for precise control of the depth and width of the flow channels and ensuring that the capillary structure is uniform across the entire board surface. This avoids the heat-affected zones and depth inconsistencies that can result from laser processing, leading to more stable heat dissipation efficiency.
- Stress-free and high flatness:
As a non-contact process, etching does not impose mechanical stress on thin copper sheets, effectively maintaining material flatness (controllable within 0.02 mm) and preventing warping and deformation.
- Flexible design and controllable costs:
For complex geometries or internal flow channels, etching requires only modifications to the design files—no additional tooling is needed. This results in lower costs and eliminates defects such as burrs and indentations.

Application of Ultra Thin Vapor Chamber:
- Consumer Electronics: Smartphones, tablets, and ultra-thin laptops
- Advanced Semiconductors: High-performance ICs and 5G communication modules
- Display Technologies: Mini-LED and MicroLED backlight units
- Precision Equipment: Compact aerospace and medical devices
As a top-tier chemical etching provider in China, we specialize in the manufacture of high-precision metal components, with particular expertise in ultra-thin vapor chambers. Our vapor chambers are fully customizable to meet your specific design and performance needs. Utilizing state-of-the-art etching processes, we deliver products free of burrs and mechanical stress, guaranteeing exceptional thermal efficiency and long-term reliability.
What's Chemical Etching?
Chemical etching, alternatively referred to as photo etching or photochemical machining (PCM), is a subtractive manufacturing process. It achieves high precision and cost-effectiveness in producing complex metal components without introducing mechanical stresses or heat-affected zones.
How's Chemical Etching Works?

We master chemical etching technology and enforce strict quality control. All materials are precisely sourced per client requirements. Post-etching, we perform 100% inspection using professional equipment such as 2.5D measuring systems, electron microscopes, and digital magnifiers to guarantee every product meets exact specifications.

Package and Shipment of Ultra Thin Vapor Chamber:
We offer multiple packaging options to ensure maximum protection, including protective covers, PE bags, and foam inserts. Customized packaging solutions are also available upon request.
Shipment Methods:
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EMS: 10-15 business days
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DHL: 3-5 business days
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FedEx: 4-6 business days
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UPS / TNT: 6-8 business days
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Air Freight: 5-7 business days
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Sea Freight: 15-30 business days
FAQ:
1.What is the price of vapor chamber customization?
-- The price will be depended on material, thickness, size and other requirements, please feel free to send us your detail requirements, we’ll offer you the price asap.
2. How do we custom the titanium vapor chamber?
-- Please send us your drawing in DXF, DWG, STEP, PDF and other formats, we’ll do the evaluation and offer you the price.
3. How can we guarantee quality?
-- We always a pre-production sample before mass production, and always 100% final Inspection before shipment.
4. Why should you buy from us not from other suppliers?
-- Xinhaisen is established to specialized in the production of high-quality, finite and micro-size photo chemical etching metal products.Our seventy professional staff specialized in research and development , manufacturing and marketing service.
5. What services can we provide?
-- Accepted Delivery Terms: FOB, CFR, CIF, EXW;
Accepted Payment Currency:USD, EUR, JPY, CAD, AUD, HKD, CNY;
Accepted Payment Type: T/T, Paypal, Western Union, Cash.
Do you want to custom the vapor chamber?
Click "contact us" below to send us the drawing of Titanium vapor chamber, we support DXF, DWG, STP etc. formats.
Or send email directly at bella.xiang@xinhsen.com / WhatsApp: +86 18025476918
Product Highlights
Copper Etching Ultra Thin High Precision Brass Vapor Chamber for Cooling System The etched copper VC heat spreader is a new-generation heat dissipation component manufactured using a precision etching process. Its key feature is the integration of capillary microstructures into the inner wall of the ...
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