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Copper Chemical Etching
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Cooper Chemical Etching Metal LC Lead Frame For Semiconductor

Cooper Chemical Etching Metal LC Lead Frame For Semiconductor

Brand Name: XHS/ Customized
Model Number: Custom
MOQ: 10
Price: 50-100USD
Payment Terms: T/T
Supply Ability: 10000-100000PCS / week
Detail Information
Place of Origin:
China
Certification:
ISO 9001, ISO 14001
Materials:
Brass, Brass Alloy, Cooper, Copper Alloy
Thickness:
0.02mm - 1.5mm
Tolerance:
+/- 0.005mm
Production Process:
Photo Chemical Etching, Plating, Stamping, Laser Cutting
Packaging Details:
PE bags and Cartons / Customized
Supply Ability:
10000-100000PCS / week
Highlight:

Chemical etching cooper

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Metal etching cooper

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Semiconductor chemical etching

Product Description

Metal Chemical Etching Cooper LC Lead Frame For Semiconductor



Xinhaisen - 13 years ISO-certified photochemical etching expert


Xinhaisen specializes in high-precision metal chemical etching, providing advanced micro-fabrication solutions for the semiconductor industry. The copper LC lead frame is one of our core etched products, manufactured with tight tolerances and fine line accuracy to ensure excellent electrical and thermal conductivity in IC packaging and electronic applications.


Our chemical etching process is ideal for producing burr-free and stress-free lead frames with complex patterns that traditional stamping or laser cutting cannot achieve.

Cooper Chemical Etching Metal LC Lead Frame For Semiconductor 0



Specifications of Etching Lead Frame for Semiconductor


Metal materials:
  • Copper and copper alloys (C1100, C194, C2680, etc.)

  • Stainless steel (SUS301, SUS304, SUS316)

  • Nickel and nickel alloys (Ni200, Ni42, Invar, Kovar)

  • Titanium and aluminum

Thickness range: 0.02 mm – 1.5 mm
Sheet or coil width: up to 600 mm
Etching tolerance: ±0.01 mm (According to the drawings)
Min. line width/spacing: 0.05 mm (Accoridng to the drawings)



Key advantages of Etching Lead Frame for Semiconductor

Cooper Chemical Etching Metal LC Lead Frame For Semiconductor 1
  • Fast prototyping
  • 10M+ annual capacity
  • Burr/stress-free production
  • DFM analysis support
  • Strict quality control
  • Competitive MOQ options
  • Global logistics solutions



Available Secondary Processes

In addition to photochemical etching, we provide integrated post-processing options to meet customized needs:

  • Plating (gold, silver, nickel, tin)

  • Half-etch marking / logo etching

  • Forming and bending

  • Surface treatment (passivation, cleaning)

  • Reel-to-reel continuous production


Etching Process Capability

Our advanced photochemical etching lines enable:

  • Fine pattern accuracy with smooth edges and no mechanical stress

  • Consistent mass production using reel-to-reel processing

  • Complex and thin designs with micro-holes and micro-channels

  • Rapid prototyping to large-scale manufacturing

We produce not only semiconductor lead frames, but also:

  • EMI/RFI shielding covers

  • Precision filter meshes

  • Battery current collectors

  • Heat exchanger plates

  • Microfluidic flow plates

  • Connector contacts and metal shims

Cooper Chemical Etching Metal LC Lead Frame For Semiconductor 2


Advantages of Chemical Etching

  • No mechanical stress or deformation

  • Burr-free edges with clean profiles

  • Ideal for thin and delicate materials

  • High design flexibility and short tooling time

  • Cost-effective for prototype and mass production



How to etching lead frame from us?


1.Please send us your design.
  We accept the following file formats: DWG, DXF, PDF, Step, Gerber, IGES, CorelDraw and Adobe Illustrator
2.Samples making lead time:3-10days
3.Express:By DHL,Fedex,TNT,around 3-7days.


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