High Performance Vapor Chambers Precision Etched for Superior Thermal Dissipation

Vapor Chambers Overview

Xinhsen’s vapor chambers are ultra-thin, two-phase heat spreaders designed to efficiently transfer heat away from high-power components like CPUs, GPUs, LED arrays, and 5G modules. Utilizing precision chemical etching, we create optimized wick structures and vapor channels that outperform traditional heat pipes and solid metal heat sinks. Our vapor chambers ensure uniform temperature distribution, lower hotspot temperatures, and compact integration in space-constrained devices.

Key Advantages

✔ Ultra-thin designs (as low as 0.3mm) for slim devices
✔ High thermal conductivity (5-10x better than copper)
✔ Custom wick structures (mesh, groove, sintered powder)
✔ Leak-proof & long lifespan (robust laser welding & sealing)
✔ Lightweight & corrosion-resistant (compatible with various working fluids)

Vapor Chambers Specifications

Design & Customization Options

• Shapes: Rectangular, circular, L-shaped, custom cutouts

• Wick Optimization: Multi-layer wicks for high heat flux zones

• Fluid Charge: Adjustable for different operating temperatures

• Attachment Features: Pre-applied thermal interface material (TIM), mounting holes, soldering pads

Performance Data

◈ 30% lower thermal resistance vs. solid copper heat spreaders
◈ Hotspot reduction from 100°C to <70°C in typical CPU applications
◈ Uniformity: ±1°C across surface (for high-end electronics)

Applications

▸ Consumer Electronics: Smartphones, laptops, tablets
▸ 5G & Telecom: Base stations, RF power amplifiers
▸ Automotive: EV battery cooling, LED headlights
▸ Aerospace: Avionics thermal management
▸ Medical Devices: Laser diode cooling

Quality Assurance

✔ 100% pressure & leak testing
✔ Material certifications (RoHS, REACH compliant)
✔ 3D X-ray inspection for internal structure integrity
✔ ISO 9001 & IATF 16949 (automotive-grade)

Why Choose Xinhsen Vapor Chambers?

• Precision etching ensures consistent micro-channel/wick structures

• Fast prototyping (5-7 days for samples)

• Mass production capacity: 100,000+ units/month

• DFM support – Optimize designs for cost & performance

Request a quote today! Provide your thermal requirements for a customized solution.